| |
PartNo |
Mfg |
Qty |
Price |
Packing |
D/C |
Date |
|
THS8083APZP |
TI |
785420 |
|
LQFP |
13+ROHS |
2026-02-20 |
|
W89C940F |
WINBOND |
85230 |
|
QFP100 |
13+ |
2026-02-20 |
|
2DI150A-120 |
FUJI |
11750 |
|
IGBT MODULE 模块150A 1200V |
13+ |
2026-02-20 |
|
PIC16F874 |
MICROCHIP |
78005 |
|
DIP |
13+RoHs |
2026-02-20 |
|
PIC16F874A-I/P |
MICROCHIP |
78005 |
|
DIP |
13+RoHs |
2026-02-20 |
|
2DI150A-120B |
FUJI |
66600 |
|
IGBT MODULE 模块 150A 1200V |
13+RoHS |
2026-02-20 |
|
W2464-10L |
winbond |
8536 |
|
DIP-28 |
13+ |
2026-02-20 |
|
2DI150A-140 |
FUJI |
26600 |
|
IGBT Power Module 模块 |
13+ |
2026-02-20 |
|
TI200 |
NVIDIA |
1236 |
|
SOP |
13+RoHS |
2026-02-20 |
|
PIC16F876 |
MICROCHIP |
68000 |
|
SOP |
13+RoHs |
2026-02-20 |
|
PIC16F876-04/SO |
MICROCHIP |
68000 |
|
SOP |
13+RoHs |
2026-02-20 |
|
2DI150D-050 |
FUJI |
66600 |
|
IGBT MODULE 模快 |
14+RoHS |
2026-02-20 |
|
TI500 |
TI |
1236 |
|
SOP-8 |
13+RoHs |
2026-02-20 |
|
PIC16F876A-I/SP |
MICROCHIP |
68000 |
|
DIP |
13+RoHs |
2026-02-20 |
|
2DI150MA-050 |
FUJI |
17500 |
|
IGBT MODULE 模块150A 500V |
13+ |
2026-02-20 |
|
PIC16F876A-I/SO |
MICROCHIP |
78005 |
|
SOP |
13+RoHs |
2026-02-20 |
|
W24257 |
WINBOND |
85360 |
|
DIP-28 |
13+ |
2026-02-20 |
|
2DI150Z-100 |
FUJI |
26600 |
|
IGBT MODULE 模块150A 1000V |
13+RoHS |
2026-02-20 |
|
PIC16F877A-I/P |
MICROCHIP |
68000 |
|
DIP |
13+RoHs |
2026-02-20 |
|
W24257AJ-15 |
WINBOND |
85360 |
|
SOJ |
13+ |
2026-02-20 |
|
2DI150Z-120 |
FUJI |
66600 |
|
IGBT MODULE 模块150A 1200V |
13+ |
2026-02-20 |
|
W24257K-70LL |
WINBOND |
85360 |
|
PDIP28 |
13+ |
2026-02-20 |
|
PIC16F884 |
MICROCHIP |
78005 |
|
DIP |
13+RoHs |
2026-02-20 |
|
PIC16F884-I/P |
MICROCHIP |
78005 |
|
DIP |
13+RoHs |
2026-02-20 |
|
W24258Q-70LE |
WINBOND |
85230 |
|
TSSOP |
13+ |
2026-02-20 |
|
Select All |
|
