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  型号 厂家 数量 单价 封装 批号 日期
TDA8885H
PHI
4566
QFP
13+ROHS
2026-02-14
TDA8931T
PHI
63555
SOP
13+ROHS
2026-02-14
TDA8943SF
PHI
785420
ZIP9
13+ROHS
2026-02-14
TDA8946J
PHI
785420
ZIP
13+
2026-02-14
TDA8947J
PHI
4566
ZIP-17
13+RoHS
2026-02-14
QSC-6030-0-351MSP
QUALCOMM
68000
BGA
13+RoHs
2026-02-14
QSC-6055-0-424CSP
QUALCOMM
78005
Standard
13+RoHs
2026-02-14
TDA9580H
PHI
4566
QFP
13+RoHS
2026-02-14
QSC-6075-0-424CSP
QUALCOMM
68000
Standard
13+RoHs
2026-02-14
TDA9588H
PHI
785420
QFP
13+RoHs
2026-02-14
QU80386EX33
INTEL
78005
QFP
13+RoHs
2026-02-14
QU80386
INTEL
50000
QFP
13+RoHs
2026-02-14
QU80386EXTB25
INTEL
68000
QFP
13+RoHs
2026-02-14
TDK73K322L-IP
TDK
1236
DIP
13+RoHS
2026-02-14
TDOTG242LPF
TDI
4566
QFP64
13+ROHS
2026-02-14
TE28F640J3D75
INTEL
125000
TSOP
13+RoHS
2026-02-14
TEA1506P
PHI
1236
DIP
13+ROHS
2026-02-14
TEA1610T
NXP
785420
SMD16
13+RoHS
2026-02-14
TEA2028B
ST
4566
DIP8
13+ROHS
2026-02-14
TEA2029A
ST
1236
DIP-28
13+ROHS
2026-02-14
TEA2029CV
ST
63555
DIP
13+RoHS
2026-02-14
TEA5101A
ST
1236
ZIP
13+RoHs
2026-02-14
TEA5101B
ST
785420
ZIP
13+RoHS
2026-02-14
TEA5767HN
PHI
63555
QFN
13+ROHS
2026-02-14
W78E51B-40
WINBOND
85360
DIP-40
13+
2026-02-14
全选
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